CH6063H12864 cog lcd factory
Product Description
1.1 COG process, FPC welding process, product with PCB board, backlight, iron frame, thin thickness and stable structure.
1.2 IC uses ST7567. There is no font library in the chip, and the programmer compiles his own font library.
1.3 Low power consumption, only 3.3V power mode, no backlight current within 1mA, backlight current within 80mA
1.4 LED backlights A and K are PCB boards that have been welded to PCB boards. LED can be driven by PIN1,PIN2,PIN19,PIN20
1.5 Product Features:
The built-in display data RAM is 64x128 bits. Built-in boost circuit. The contrast ratio is deeply to shallow by the software. One screen displays 8 characters x 4 lines (16x16 dot matrix). Single picture ≦128x64 dot matrix. 4-wire SPI interface communication. Rich functions: The interface shows on/off, positive/inverted.
1.2 IC uses ST7567. There is no font library in the chip, and the programmer compiles his own font library.
1.3 Low power consumption, only 3.3V power mode, no backlight current within 1mA, backlight current within 80mA
1.4 LED backlights A and K are PCB boards that have been welded to PCB boards. LED can be driven by PIN1,PIN2,PIN19,PIN20
1.5 Product Features:
The built-in display data RAM is 64x128 bits. Built-in boost circuit. The contrast ratio is deeply to shallow by the software. One screen displays 8 characters x 4 lines (16x16 dot matrix). Single picture ≦128x64 dot matrix. 4-wire SPI interface communication. Rich functions: The interface shows on/off, positive/inverted.
